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Ceramic Packages

Product Summary

Kyocera has been supplying ceramic packages since 1964. Our ceramic packages are used for a wide range of semiconductor and electronic devices such as image sensors, accelerometers, gyroscopes, microprocessors, light emitting diodes (LEDs), fiber-optic communication modules, radio-frequency power transistors, monolithic microwave integrated circuits (MMICs), crystal devices, and surface-acoustic wave (SAW) devices. Housed in our ceramic packages, these types of devices are used for mobile phones, wireless and fiber-optic communication infrastructure equipment, automobiles, computers, medical devices, industrial manufacturing equipment, and scientific research equipment.

Product Line-Up

Kyocera provides custom designed ceramic packages and components to meet specific customer requirements. Standard (open tool) products are also available for device evaluation and low volume orders.

*For more detailed info, please visit the Kyocera Global site.

Surface Mount Ceramic Packages for Electronic Devices

Standard Packages and Lid for Devices Evaluation

Ceramic Packages and Optics for Image Sensors

Ceramic Packages for Light Emitted Diodes (LED)

Components For Fiber Optics Communication ( Module )

Ceramic Packages for Power Electronics

Ceramic Packages for Large Scale Integration (LSI)

Ceramic Packages for Automotive Electronics

Components For Wireless Communication Devices

Components For Fiber Optics Connector

LTCC Packages For RF Module

Ceramic Substrates For Probe Cards

Ceramic Packages for MEMS Sensors

Glass Hermetic Feedthroughs

RFID Package and Tag

LiDAR and 3D Sensing